Intel giới thiệu Ice Lake 10nm cho cho Thiết bị di động, Cascade Lake và Lake Field

Felina x64

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This article contains live coverage of Intel's CES 2019 keynote, where the company announced new 9th-Generation desktop and mobile processors, provided more detail and a demo of its Lake Field processors, and announced that 10nm Ice Lake processors will come to market this year. The company also announced that it is shipping its next-gen Cascade Lake Xeon processors and introduced a new 10nm Snow Ridge SoC for 5G base stations.
This article contains live coverage of Intel's CES 2019 keynote, where the company announced new 9th-Generation desktop and mobile processors, provided more detail and a demo of its Lake Field processors, and announced that 10nm Ice Lake processors will come to market this year. The company also announced that it is shipping its next-gen Cascade Lake Xeon processors and introduced a new 10nm Snow Ridge SoC for 5G base stations.

Intel's keynote began with Senior Vice President of the Client Computing Group Gregory Bryant defining what Intel calls the "new era of computing." This includes several technologies, like cloud-based solutions, desktop PCs, 5G networking, AI, and data center products, among others. Bryant described the breadth of new markets these areas expose, which ultimately equates to a $300 billion opportunity for the company.
Bryant almost immediately announced that Intel is launching six new 9th-Generation processors for the desktop PC that range from Core i3 up to Core i9, and then moved directly to a music demo without providing model numbers or specifications for the new chips. [EDIT: We have details of the seven new models here] The musicians then used a desktop PC to demonstrate how they could create music in real time using Intel's new unnamed processors. Intel says the first new 9th-Gen processors will come to market this month, with more rolling out through the second quarter of this year.

Intel also announced that it will also bring new H-Series mobile CPUs to market in the second quarter of this year, but again didn't elaborate on specifications or model numbers. Bryant explained that people want a platform that allows them to focus, adapt, and always be ready for the next challenge. Intel claims that requires a new system-level approach with a new processor to fully realize that goal.
Bryant then displayed a 10nm Ice Lake processor that comes with Gen11 graphics, native Thunderbolt 3, WiFi-6, and artificial intelligence (boosted by DL Boost) into a single SoC. Intel demonstrated the Ice Lake chip offering a 2x performance boost to processing images. The company also demoed an Ice Lake system playing a game while using Thunderbolt 3 to connect to a storage device and a display.
The new 10nm ice Lake processors will come to market in high volume in 2019. These chips come with a 1.7X density improvement over the 14nm process that Intel currently uses for its processors. The long-overdue 10nm process should let Intel create cheaper and more power efficient chips as a byproduct of the improved density.
The Sunny Cove microarchitecture is the first new design that Intel can use on multiple nodes. Intel has typically used the same naming convention for its microarchitectures as it does for its processors. Hence, Skylake processors came with the Skylake architecture, and Kaby Lake processors came packing the Kaby Lake architecture. That old paradigm changes now that Intel has decoupled its architectures from the end products, so the 10nm Ice Lake chips come with Sunny Cove cores.
The chips will bring higher performance in single-threaded applications, a new instruction set architecture (ISA), and a design geared for scalability.

Dell's CEO came to stage and displayed a new Dell XPS 2-in-1 with the new Ice Lake processor. Intel announced that it is rallying all of its partners around a new Ultrabook-like program called Project Athena. This program will define new industry standards that define the next generation of mobile products. The new initiative includes technologies like 5G and AI. Intel says this industry-wide innovation program has a number of partners and the leading-edge products will come to market in the second half of the year.

To be continued...
https://www.tomshardware.com/news/in...cpu,38365.html
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Chicat

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Troll: 10nm của Tèo mới là thượng đẳng nhé, 7nm của AMD chỉ là fake thôi.:shame:
 

luanducgk

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mới mua con lap 2 nhân i5 7200u ngoái -_- chuẩn bị lỗi thời cmnr. Đm intel. Khinh thường người dùng vl

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miliket

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luanducgk said:
mới mua con lap 2 nhân i5 7200u ngoái : -_- -_- chuẩn bị lỗi thời cmnr. Đm intel. Khinh thường người dùng vl
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Bậy nào. Intel tôn trọng giá trị tài sản người dùng cả chục năm. Từ Haswel tới Coffee, nhưng vì dạo gần đây thằng ôn Amd chơi bẩn. Nên Intel mới nâng Cpu liên tục đấy chứ.
 

cao9duoi_05

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Intel debuted its new Lake Field processors on a new small motherboard. These new processors are the first to come to market with Intel's new 3D chip-stacking technology, code-named Foveros. Intel has expanded on the concept of using multiple chips and now will stack die atop each other, thus improving density. The key idea behind chip stacking is to mix and match different types of dies, such as CPUs, GPUs, and AI processors, to build custom SOCs (System-On-Chip). It also allows Intel to combine several different components with different processes onto the same package. That lets the company use larger nodes for the harder-to-shrink or purpose-built components. That's a key advantage as shrinking chips becomes more difficult.

The current design consists of two dies. The lower die houses all of the typical southbridge features, like I/O connections, and is fabbed on the 22FFL process. The upper die is a 10nm CPU that features one large compute Sunny Cove core and four smaller 'efficiency' cores (atom), similar to an ARM big.LITTLE processor. Intel calls this a "hybrid x86 architecture." This small package measures a mere 12mm2.
Vụ này hay ghê. 1 con Core i chính và nhiều con atom phụ :sexy:
 

OopsNotFound

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cao9duoi_05 said:
Vụ này hay ghê. 1 con Core i chính và nhiều con atom phụ :sexy:
Nhìn quá khứ đám windows phone thì ms chưa bao giờ ngon nghẻ trong khoản tiết kiệm năng lượng kiểu này :sweat:
 

I_Newbie

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cao9duoi_05 said:
Vụ này hay ghê. 1 con Core i chính và nhiều con atom phụ :sexy:
Bản thân thằng atom hiệu năng kém, pin kém, stack 1 đống thế thà chơi 1 con Core i U có khi ngon hơn. Thà pin kém hơn tí nhưng hiệu năng không quá thọt :sweat:
 

jacobien

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I_Newbie said:
Bản thân thằng atom hiệu năng kém, pin kém, stack 1 đống thế thà chơi 1 con Core i U có khi ngon hơn. Thà pin kém hơn tí nhưng hiệu năng không quá thọt :sweat:
atom hồi trước kém nhưng từ Baytrail (2014) thì ngon rồi, hiệu năng, pin này nọ ổn lắm
 
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